JPH0645302Y2 - 締付装置 - Google Patents
締付装置Info
- Publication number
- JPH0645302Y2 JPH0645302Y2 JP1988013103U JP1310388U JPH0645302Y2 JP H0645302 Y2 JPH0645302 Y2 JP H0645302Y2 JP 1988013103 U JP1988013103 U JP 1988013103U JP 1310388 U JP1310388 U JP 1310388U JP H0645302 Y2 JPH0645302 Y2 JP H0645302Y2
- Authority
- JP
- Japan
- Prior art keywords
- tightening
- nut runner
- jig
- tightening device
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Automatic Assembly (AREA)
- Details Of Spanners, Wrenches, And Screw Drivers And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988013103U JPH0645302Y2 (ja) | 1988-02-03 | 1988-02-03 | 締付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988013103U JPH0645302Y2 (ja) | 1988-02-03 | 1988-02-03 | 締付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01117833U JPH01117833U (en]) | 1989-08-09 |
JPH0645302Y2 true JPH0645302Y2 (ja) | 1994-11-24 |
Family
ID=31223134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988013103U Expired - Lifetime JPH0645302Y2 (ja) | 1988-02-03 | 1988-02-03 | 締付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0645302Y2 (en]) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7102763B2 (en) | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7399713B2 (en) | 1998-03-13 | 2008-07-15 | Semitool, Inc. | Selective treatment of microelectric workpiece surfaces |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0340481Y2 (en]) * | 1985-08-03 | 1991-08-26 |
-
1988
- 1988-02-03 JP JP1988013103U patent/JPH0645302Y2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7399713B2 (en) | 1998-03-13 | 2008-07-15 | Semitool, Inc. | Selective treatment of microelectric workpiece surfaces |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7102763B2 (en) | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
Also Published As
Publication number | Publication date |
---|---|
JPH01117833U (en]) | 1989-08-09 |
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